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About Us

About Us

About Us

SINCE 2011

National High-tech Enterprise

National Intellectual Property Advantage Enterprise

National Specialized, Fined, Peculiar and Innovative Enterprise(SFPI)

Shenzhen Think Future Semiconductor Co., Ltd., established in 2011, focuses on innovative design of high-performance analog chips and mixed-signal SoC chips, striving to provide leading power management chips for industries such as smart wearables, data center, and new energy.

We have branch offices in Shenzhen, Shanghai, Chengdu and Zhuhai with about over 60% staffs are in R&D team. They have graduated from well-known universities such as  Hong Kong University of Science and Technology, Peking University, Huazhong University of Science and Technology, University of Electronic Science and Technology of China, Xi'an Jiaotong University, Xidian University, etc. More than 50% of them hold master's degrees or above. Additionally, Our team members have experience in top companies like ST, TI, Intersi, Hisilicon, etc.. As of now, we've applied for and obtained over 200 independent intellectual property rights.

Based on our extensive knowledge and established technology architectures in battery and power management chips, we will continue to intensify our product research and development efforts in the consumer electronics market and industrial sectors. Through relentless technological innovation, we aim to enhance our core competitiveness.

Simultaneously, we have initiated R&D ventures in fields such as smart wearables, storage, energy storage, servers, and automotive electronics. In the future, you will be seen a more diversified product portfolio from Think Future Semiconductor, along with a richer array of markets and customer bases. We are actively seeking strategic partners for deep cooperation and mutual growth in emerging markets!

Years of experience 
in Li-ion battery 
power management IC

13

Branch Offices
(Shenzhen/Shanghai/Chengdu/Zhuhai)

4

R&D personnel 
accounting for 

60+%

R&D investment accounting 
for three consecutive years

25+%
Development History
2024
2023
2022
2021
2019-2020
2017
2011-2016
2024

-Cumulative shipments exceeded 1.5 billion PCS

-Recognized as"Guangdong Power Management Chip Engineering Technology Research Center"

2023

-Recognized as National Specialized, Fined, Peculiar and Innovative Enterprise

-Recognized as Shenzhen Specialized, Fined, Peculiar and Innovative Enterprise

-Recognized as National Intellectual Property Advantage Enterprise

2022

-Multiple chips positioned in new energy, data centers, and industrial sectors

-Won 2022 China Excellent Enterprise in Analog Semiconductor

-Round B financing accomplished

2021

-Ranked No.1 in TWS cradle SoC market share shipments 700KK+

-Won "The Technology Innovation Award" at the 2021 China IoT Conference

-Awarded "The Best New Company of The Yea" in the 2022 China IC Top Award Ceremony 

2019-2020

-TWS cradle SoC  shipments exceeded 100 million PCS (2019)

-Established partnerships with renowned brands such as Xiaomi, OPPO, OnePlus, realme, and Meizu etc. (2019)

-Round A financing accomplished (2020)


2017

-Recognized as National High-Tech Enterprise

-Enter TWS market

-Power bank SoC shipments 80KK+ PCS

2011-2016

-Headquarters est. (2011)

-11 pcs of chips MP(2011)

-23 pcs of chips MP(2012)

-Developing power bank SoC(2012)

-Ranked NO.1 in the industry for 1A power bank SoC shipments(2016)

Core Values

Customer-centricity

Continuous learning and willing to share

Open communication and proactive collaboration

Innovative and actions-oriented

Quality-focused and continuous improvement

Long-termism